Polyolefin film and radiative cooling structure body
US11319472B1 · kind B1 · utility
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Key dates
| Filing date | Dec 21, 2021 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Dec 21, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2245/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides a polyolefin film including a fibrous polyolefin having an average diameter of 0.1 μm or more and less than 1.0 μm, wherein the polyolefin film has a connected-void structure, has a void ratio a of 50% to 90%, has a thickness d in μm, which satisfies, together with the void ratio a, a relation of 40≤(d×(100−a)/100)≤200, and is used as a radiative cooling film, and a radiative cooling structure body including the polyolefin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.