Patent · US Active

Apparatus and method for vacuum deposition

US11319626B2 · kind B2 · utility

0Cited by
7References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 27, 2017
Grant dateMay 3, 2022
Priority date
Expiry dateNov 23, 2037

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C14/562
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A vacuum deposition facility is provided for continuously depositing on a running substrate coatings formed from metal alloys including a main element and at least one additional element. The facility includes a vacuum deposition chamber and a substrate running through the chamber. The facility also includes a vapor jet coater, an evaporation crucible for feeding the vapor jet coater with a vapor having the main element and the at least one additional element, a recharging furnace for feeding the evaporation crucible with the main element in molten state and maintaining a constant level of liquid in the evaporation crucible, and a feeding unit being fed with the at least one additional element in solid state for feeding the evaporation crucible with the at least one additional element either in molten state, in solid state or partially in solid state. A process is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.