Methods for forming a flat surface MIO structure

US11319639B2 · kind B2 · utility

Assignee

• TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. · US

Inventors

• Shailesh N. Joshi · Ann Arbor, US
• Paul V. Braun · Champaign, US
• Gaurav Singhal · Champaign, US

Key dates

• Filing date: Jan 30, 2020
• Grant date: May 3, 2022
• Expiry date: Jul 18, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/161
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of the disclosure relate to methods for forming a flat surface MIO structure for bonding and cooling electronic assemblies. In one embodiment, the method includes providing a plurality of particles on a surface of a base substrate. A metal is then deposited onto the plurality of particles up to a desired level to form a metal layer such that the plurality of particles is partially covered by the metal layer. An adhesive member is then applied to the plurality of particles exposed above the metal layer. Finally the adhesive member is pulled to remove individual particles of the plurality of particles that are exposed above the metal layer.