Intelligent defect identification system
US11320385B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2018 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Nov 17, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/20081
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various defects in an electronic assembly can be intelligently identified with a system having at least a server connected to a first capture module and a second capture module. The first capture module may be positioned proximal a first manufacturing line while the second capture module is positioned proximal a second manufacturing line. Images can be collected of first and second electronic assemblies by respective first and second capture modules prior to the images being sent to a classification module of the server where at least one defect is automatically detected in each of the first and second electronic assemblies concurrently with the classification module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.