Chip package
US11320464B2 · kind B2 · utility
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1References
6Claims
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Key dates
| Filing date | Sep 11, 2020 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Sep 11, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R15/202
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A chip package according to one embodiment includes a magnetic field sensor and a chip housing. The chip housing is a rectangular parallelepiped body. A solenoid coil is wound around four outer surfaces of the chip housing. The magnetic field sensor is disposed in the chip package. A plurality of first electrode pads connected to the solenoid coil and a plurality of second electrode pads connected to the magnetic field sensor are disposed on one mounting surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.