Patent · US Active

Process for fabricating a photonic chip via transfer of a die to a receiving substrate

US11320592B2 · kind B2 · utility

0Cited by

1References

21Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Sylvie Menezo · Voiron, FR
Bertrand Szelag · Grenoble, FR

Key dates

Filing date	Oct 23, 2020
Grant date	May 3, 2022
Priority date	—
Expiry date	Oct 23, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/22
WIPO fieldOptics
WIPO sectorInstruments

Abstract

The invention relates to a process for fabricating a photonic chip including steps of transferring a die to an actual transfer region of the receiving substrate comprising a central region entirely covered by the die and a peripheral region having a free surface, a first waveguide lying solely in the central region, and a second waveguide lying in the peripheral region; depositing an etch mask on a segment of the die and around the actual transfer region; and dry etching a free segment of the die, the free surface of the peripheral region then being partially etched.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.