Light emitting assembly and optical module
US11320609B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2021 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Jan 29, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/2938
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to the technical field of optical communication, and provides a light emitting assembly comprising: an LD chip component, an optical wavelength division multiplexer, a first package housing and a second package housing; the first package housing is fixedly connected with the second package housing to form a first chamber for packaging the LD chip component and a second chamber for packaging the optical wavelength division multiplexer, the first chamber is located inside the first package housing, and the second chamber is located inside the second package housing. The present invention also provides an optical module comprising: a housing, a light receiving assembly and the light emitting assembly mentioned above, wherein the light receiving assembly and the light emitting assembly are both disposed on the housing. The present invention adopts a two-section structure, so that the LD chip component and the optical wavelength division multiplexer are independently separated, and the optical signal processing is carried out in two steps, which not only improves the yield, but also facilitates the implementation of the mounting process. By adopting the opt…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.