Surface mounting techniques for fiber optics printed circuit board assemblies using metal coatings and tabs
US11320611B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2020 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Apr 27, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.