Integrated circuit thermal throttling with workload adapted thermal sensor maximum temperature
US11320877B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 10, 2020 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Jul 10, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for integrated circuit (IC) thermal throttling is described. In one embodiment, the apparatus comprises a plurality of thermal sensors, each of the plurality of thermal sensors being located in an area in the IC to record a die temperature at a location in its associated area; and a thermal controller coupled to the plurality of thermal sensors to perform thermal throttling of the IC to reduce the temperature of the IC in response to the die temperature recorded by any one temperature sensors of the plurality of thermal sensors being greater than an individual temperature threshold for said any one temperature sensor, the individual temperature threshold for each temperature sensor being based on a maximum temperature allowed for the area in the IC in which said each thermal sensor is located and power supplied to a plurality of areas of the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.