Electronic module
US11322448B2 · kind B2 · utility
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9Claims
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Assignee
Inventor
Key dates
| Filing date | Jan 17, 2018 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Feb 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92246
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic module has a first substrate 11; a second substrate 21 provided in one side of the first substrate 11; and a chip module 100 provided between the first substrate 11 and the second substrate 21. The chip module 100 has an electronic element 13, 23 and a connecting body 60, 70, 80 electrically connected to the electronic element 13, 23. The electronic element 13, 23 extends along a first direction that is a thickness direction of the electronic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.