Semiconductor device and manufacturing method, and electronic appliance
US11322539B2 · kind B2 · utility
1Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2020 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Jun 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a semiconductor device including: a plurality of bumps on a first semiconductor substrate; and a lens material in a region other than the plurality of bumps on the first semiconductor substrate, wherein a distance between a side of a bump closest to the lens material and a side of the lens material closest to the bump is greater than twice a diameter of the bump closest to the lens material, and wherein the distance between the side of the bump closest to the lens material and the side of the lens material closest to the bump is greater a minimum pitch of the bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.