Light-emitting device package
US11322667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2018 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Sep 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
Abstract
A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.