Interconnector with a rugged surface for better tightness
US11322753B2 · kind B2 · utility
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17Claims
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Assignee
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Key dates
| Filing date | Dec 14, 2018 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Dec 14, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Implementation of an interconnector structure for an SOEC or SOFC electrochemical device, the interconnector being formed of a conductive support element having a first face with a rough region, the roughness of which has been modified locally before being brought into contact with a seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.