Light emitting element housing package, light emitting device, and light emitting module
US11322907B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2019 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Feb 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A light emitting element housing package of the present disclosure includes a base part including a first surface including a first recessed part for mounting a light emitting element. Surface roughness Sa of at least such a region of a bottom surface of the first recessed part that is opposite to a light emitting element mounted on the first recessed part is smaller than surface roughness Sa of a region other than the first recessed part of the first surface. Further, a light emitting device of the present disclosure includes the light emitting element housing package and a light emitting element housed in the light emitting element housing package. Further, a light emitting module of the present disclosure includes the light emitting device and a module substrate on which the light emitting device is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.