MEMS device with a diaphragm having a slotted layer
US11323823B1 · kind B1 · utility
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20Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 18, 2021 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Jan 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An MEMS acoustic transducer includes a substrate having an opening formed therein, a diaphragm comprising a slotted insulative layer, and a first conductive layer. The slotted insulative layer is attached around a periphery thereof to the substrate and over the opening, and the first conductive layer is disposed on a first surface of the slotted insulative layer. A backplate is separated from the diaphragm and disposed on a side of the diaphragm opposite the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.