Cooling apparatus for electronic element
US11324106B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2020 |
| Grant date | May 3, 2022 |
| Priority date | — |
| Expiry date | Jul 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body. The heat transfer part has one end connected to the outer surface of the housing main body and another end connected to the additional cooling part to transfer heat generated from the plurality of electronic elements to the additional cooling part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.