Porous polyurethane polishing pad and method for manufacturing same
US11325222B2 · kind B2 · utility
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2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2018 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Sep 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.