Method for producing pictorial relief structures
US11325368B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2017 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Jul 8, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0037
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method for producing pictorial relief structures on a layer construction. The method comprises the provision of a layer construction having a substrate layer. After this, at least one fluid containing at least one first reactive component is applied pictorially to the substrate, wherein the pictorial application takes place in the form of a plurality of droplets with a droplet volume of less than 2 μl, and wherein the droplets are positioned pictorially. After this, there is an at least partial diffusing of the at least one first reactive component into the substrate layer for a predefined exposure time and/or an at least partial diffusing of at least one second reactive component into the pictorially positioned droplets of fluid for a predefined exposure time, wherein the substrate layer comprises the at least one second reactive component. The created relief is then fixed under the influence of heat and/or radiation via a reaction involving the first reactive component and/or the second reactive component.Further aspects of the invention relate to a pictorial relief structure produced according to the method and to the use of the pictorial relief struct…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.