Solvent composition, adhesive composition, and method of bonding surfaces
US11326078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2018 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Jul 6, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D7/5018
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
In an embodiment a solvent composition can comprise, based on the total volume of the solvent composition, 10 to 95 volume percent of a first solvent, wherein the first solvent has Hansen solubility parameters of: 15 MPa0.5≤δD≤17 MPa0.5, 4≤δP≤10.5 MPa0.5, and 7≤δH≤10 MPa0.5; 5 to 95 volume percent of a second solvent, wherein the second solvent has Hansen solubility parameters of: 16 MPa0.5≤δD≤17.5 MPa0.5, 0≤δP≤3 MPa0.5, and 0≤δH≤3 MPa0.5; and 0 to 85 volume percent parachlorobenzotrifluoride; wherein the amounts of the first solvent, the second solvent, and parachlorobenzotrifluoride sum to at least 85 volume percent. The first solvent can comprise methyl acetate, acetone, dimethyl carbonate, ethyl acetate, n-butylamine, propyl acetate, tetrahydrofuran, or a combination thereof. The second solvent can comprise cyclohexene, cyclohexane, cyclopentane, methylcyclohexane, or a combination thereof. The solvent compositions are particularly useful in an adhesive composition. An adhesive composition includes the solvent composition, a rubber, and a tackifying resin. A method of bonding two surfaces is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.