Compositions for sealing an annulus of a wellbore
US11326087B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Jun 19, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Sep 3, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2103/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A sealing composition for sealing an annulus of a wellbore includes from 20 weight percent to 97 weight percent epoxy resin based on the total weight of the composition. The epoxy resin comprising at least one of 2,3-epoxypropyl o-tolyl ether, alkyl glycidyl ethers having from 12 to 14 carbon atoms, or a compound having formula (OC2H3)—CH2—O—R1—O—CH2—(C2H3O), where R1 is a linear or branched hydrocarbyl having from 4 to 24 carbon atoms. The sealing composition also includes from 1 weight percent to 20 weight percent curing agent based on the total weight of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.