Material for hot stamping and method for manufacturing the same
US11326226B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Dec 2, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D2211/004
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided is a material for hot stamping including: a steel sheet including carbon (C) in an amount of 0.19 wt % to 0.25 wt %, silicon (Si) in an amount of 0.1 wt % to 0.6 wt %, manganese (Mn) in an amount of 0.8 wt % to 1.6 wt %, phosphorus (P) in an amount less than or equal to 0.03 wt %, sulfur (S) in an amount less than or equal to 0.015 wt %, chromium (Cr) in an amount of 0.1 wt % to 0.6 wt %, boron (B) in an amount of 0.001 wt % to 0.005 wt %, balance iron (Fe), and other inevitable impurities; and fine precipitates distributed in the steel sheet, wherein the fine precipitates include nitride or carbide of at least one of titanium (Ti), niobium (Nb), and vanadium (V), and trap hydrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.