Deposition mask and method of manufacturing the same
US11326258B2 · kind B2 · utility
1Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2017 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Nov 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/166
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosures provide a deposition mask and a method of manufacturing the same. The disclosed deposition mask may include: a deposition portion including a plurality of deposition patterns; and a boundary portion surrounding the deposition portion and including a first region and a second region extending from the first region. The boundary portion may have a thickness thicker than that of the deposition portion. Through this, it is possible to prevent a thermal deformation of the mask which may occur when the mask and mask frame are welded to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.