Patent · US Active

Integrated circuit package with electro-optical interconnect circuitry

US11327259B2 · kind B2 · utility

7Cited by
21References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 7, 2017
Grant dateMay 10, 2022
Priority date—
Expiry dateJan 19, 2041

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/3511
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.