Semiconductor device and manufacturing method of semiconductor device
US11328998B2 · kind B2 · utility
1Cited by
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13Claims
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Assignee
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Key dates
| Filing date | Sep 16, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Sep 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a first semiconductor element having a first electrode on a main surface side thereof and a second electrode on a back surface side thereof; a base material provided with a connection conductor connected to the first electrode; a sealing resin provided on the base material to seal the first semiconductor element; and a first via provided in the sealing resin and electrically connected to the second electrode of the first semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.