Fingerprint sensing module
US11329096B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Sep 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensing module including an image sensor, a microlens array and a light-shielding layer is provided. The image sensor has multiple pixels. Each of the pixels has multiple light-sensing regions physically separated. Each of the light-sensing regions is adapted to receive an image beam coming from a fingerprint of user. The microlens array is disposed above the image sensor. The microlens array includes multiple microlens. A focus region of each of the microlens covers a portion of the light-sensing regions. The light-shielding layer is disposed between the image sensor and the microlens array. The light-shielding layer has multiple openings, and the positions of the openings are corresponded to the positions of the pixels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.