Light emitting device package

US11329205B2 · kind B2 · utility

Assignee

• SUZHOU LEKIN SEMICONDUCTOR CO., LTD. · CN

Inventors

• Chang Man Lim · Seoul, KR
• June O Song · Seoul, KR
• Ki Seok Kim · Pohang-si, KR

Key dates

• Filing date: Nov 30, 2018
• Grant date: May 10, 2022
• Expiry date: Nov 30, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/832

Abstract

A light emitting device package according to an embodiment may include first and second frames, a body, a light emitting device, first and second conductive parts, and first and second conductors. According to the embodiment, first and second frames may be spaced apart from each other and include first and second openings, respectively. The body may be disposed between the first and second frames. The light emitting device may be disposed on the body and include first and second bonding parts. The first and second conductive parts may be disposed under the first and second bonding parts. The first and second conductors may be disposed in the first and second openings, respectively. According to the embodiment, the first and second conductive parts may extend into the first and second openings from the first and second bonding parts, respectively, and the first and second conductors may be disposed between the first and second conductive parts and the first and second frames, respectively.