Organic film structure and preparation method thereof, encapsulation structure and preparation method thereof, and light-emitting substrate
US11329251B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Sep 13, 2018 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Apr 13, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8731
Abstract
The present disclosure relates to a method for preparing an organic film structure. The method for preparing the organic film structure may include forming a pigment mixture layer outside a region where an organic film is to be formed using a pigment liquid mixture, forming a liquid organic layer in the region where the organic film is to be formed with a first liquid organic material, and curing the pigment mixture layer and the liquid organic layer to form an indicator film and the organic film, respectively. The pigment mixture layer may include a pigment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.