TSV-based on-chip antennas, measurement, and evaluation
US11329362B2 · kind B2 · utility
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Key dates
| Filing date | Dec 18, 2019 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Dec 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6677
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. A Through-Silicon Via (TSV)-based antenna design called TSV_A establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30 mm on-chip distance. Simulation results show an improvement in network latency up to ˜13% (average improvement of ˜7%), energy-delay improvements of ˜34% on average, and an improvement in throughput up to ˜34% (average improvement).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.