Method and apparatus to use active semiconductor interposers for RF signal chain in modular stacked integrated circuits
US11329734B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
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Key dates
| Filing date | Oct 16, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Oct 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B17/13
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Described are methods and apparatuses pertaining to stacked integrated circuits having application in ultra-low-power and small form factor design, with fast prototyping and mass-production cycle time, including application for millimeter wave radio frequency circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.