Headphones and headphone systems
US11330356B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Oct 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Some headphone systems include two ear cups, a headband assembly, an interface system and a control system. Each ear cup may include an ear cup enclosure, an ear pad assembly, a speaker system and a hinge assembly. The hinge assembly may be disposed within the ear cup enclosure such that it is not visible from outside the ear cup. The headband assembly may connect with each of the ear cups via the hinge assembly. The interface system may include at least one interface and a plurality of input source buttons disposed on at least one of the ear cups. Each of the input source buttons may be configured for selecting a source of audio data received via the at least one interface. The control system may be configured for controlling the speaker system to reproduce audio data received via the interface and selected by one of the input source buttons.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.