Disassembly apparatus
US11330747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | Jul 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for dissembling electronic devices are described. The apparatus includes a housing with an aperture providing access to an interior thereof, and an adjustable support assembly positioned therein. The support assembly includes a first side plate and a second side plate with spacing in between, and a base plate for supporting an electronic device. A user interface is provided for receiving a user input, and in response to the user input, a motor is configured to drive a ram member downwards to contact and apply force to the electronic device held in the support assembly. A sensor may be included to measure the motor load current and output the measured load to an indicator to be viewed by a user for determining when a shell of the electronic device has been cracked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.