Light metal joining method and joint filler for same
US11331723B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2018 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Jun 24, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2304/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A light metal joint filler is provided. The light metal joint filler is formed by uniformly mixing a solvent with a light metal powder and a silver powder, where a powder particle size of the light metal powder is on a micron scale, and a powder particle size of the silver powder is on a nanometer scale or a submicron scale. A metal joining method of the present disclosure includes: coating a joint of two to-be-joined light metal pieces with the light metal joint filler; and hot pressing the two to-be-joined light metal pieces, so that the silver powder is sintered and bonded with the light metal powder and surfaces of the two to-be-joined light metal pieces, and completing joining of the two to-be-joined light metal pieces after the silver powder is condensed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.