Method for machining a cutting insert and corresponding device for machining a cutting insert
US11331748B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2017 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | May 20, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2791/009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method for machining a multi-layer workpiece blank (3) by means of a laser beam, comprising the following steps: specifying a machining program for machining the workpiece blank according to an ablation geometry in order to generate a desired edge and/or surface geometry (13) using a laser machining device; tensioning the workpiece blank in the laser machining device and positioning the workpiece holder in a measuring position; measuring a thickness of at least one of the layers of the multi-layer workpiece blank (3); modifying the machining program in order to machine the multi-layer workpiece blank (3) according to the measured layer thickness with an consistent ablation geometry; and machining the tensioned workpiece blank (3) using the modified machining program via a laser of the laser machining device in order to generate the desired edge and/or surface geometry (13) with a cutting edge (12). The invention also relates to a correspondingly configured device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.