Borehole junction support by consolidation of formation materials
US11332996B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 6, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | May 6, 2040 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B36/04
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A system for supporting a borehole junction includes a device configured to deploy a material in a solid state to a downhole location proximate to the borehole junction, and a heat source configured to apply heat to the material to a temperature sufficient to liquefy the material. The liquified material is configured to flow into a formation region adjacent to the borehole junction and consolidate the formation region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.