Over-molded lighting device for lamp assembly
US11333312B2 · kind B2 · utility
0Cited by
5References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Jul 9, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21W2102/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A vehicle lighting assembly may include a housing including a lower part, the lower part defining an opening; and a lighting device arranged within the housing and configured to emit light through the opening, the lighting device including at least one circuit board and a lens arranged on the circuit board, the lighting device further including a single overmolded encapsulate configured to encase the circuit board and at least a portion of the lens.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.