Signal sensing module and ultrasonic probe using the same
US11333634B2 · kind B2 · utility
0Cited by
4References
24Claims
0Family size
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Key dates
| Filing date | Oct 23, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Jan 7, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/101
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A signal sensing module includes a substrate, a sensing electrode, a piezoresistive material layer and a sensing circuit. The substrate has a surface. The sensing electrode is disposed on the substrate and is exposed from the surface. The piezoresistive material layer is formed on the surface and covers the sensing electrode. The piezoresistive material layer has a resistance value. The sensing circuit is disposed in the substrate and adapted to sense a change of resistance value when a pressure wave passes through the piezoresistive material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.