Transposed via arrangement in probe card for automated test equipment
US11333683B2 · kind B2 · utility
0Cited by
4References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 24, 2019 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Feb 11, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2834
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card in an automated test equipment (ATE) is disclosed. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins, with vertical vias in the circuit board interconnecting various conductive elements. Disclosed herein is a transposed via arrangement within a circuit board for a probe card, where adjacent vias are offset towards each other such that the inductance between the adjacent vias may be reduced to provide a desirable impedance during high frequency signal and/or power transmission.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.