High throughput disassembly system for executable code and applications
US11334360B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 29, 2021 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Apr 29, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06N3/09
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention performs high-throughput disassembly for executable code comprising a plurality of instructions. An input of the executable code is received. Exhaustive disassembly is performed on the executable code to produce a set of exhaustively disassembled instructions. An instruction flow graph is constructed from the exhaustively disassembled instructions. Instruction embedding is performed on the exhaustively disassembled instructions to construct embeddings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.