Micro LED display substrate and manufacturing method thereof
US11335582B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
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Key dates
| Filing date | Mar 25, 2019 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Dec 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a method for manufacturing a micro LED display substrate. The method may include forming an array of micro LEDs on an epitaxial wafer; transferring the array of micro LEDs on the epitaxial wafer to an adhesive layer on a surface of a transfer substrate assembly; and transferring the array of micro LEDs on the surface of the transfer substrate assembly onto corresponding pads on a driving substrate respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.