Mass transfer method and device for micro light emitting diode chips
US11335583B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 21, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Sep 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides a mass transfer method and device for micro light emitting diode chips. The method includes the following steps: performing magnetic pole electroplating on the micro light emitting diode chips obtained by peeling off the sapphire substrate to enable corresponding magnetic poles to be generated at corresponding positions of the micro light emitting diode chips; peeling off the transfer substrate, and placing the micro light emitting diode chips obtained by peeling off the transfer substrate in a dispersion liquid to form a solution in which micro light emitting diode chips are dispersed; and the display substrate picks up the micro light emitting diode chips dispersed under the action of the magnetic field force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.