Universal semiconductor-based automatic highspeed serial signal testing method
US11336554B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2018 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Mar 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2007/386
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a universal semiconductor automatic high-speed serial signal testing method, comprising: a chip to be tested sending, to an impedance matching unit, a high-speed serial signal; then by means of a phase shift unit, sequentially transforming, according to a set fixed resolution, the phase of the high-speed serial signal, the magnitude of each offset phase being determined by a phase shift control signal outputted by a control unit and the resolution of the phase shift unit; after passing through the phase shift unit, the high-speed serial signal keeps channel impedance matching by means of the impedance matching unit; the signal entering an acquisition unit, and being acquired under the action of an acquisition control signal sent by the control unit; the control unit performing signal exchange with semiconductor automatic testing equipment (ATE); and the acquisition unit transmitting the acquired signal back to the universal semiconductor ATE for algorithm operation, and then the actual high-speed serial data stream is obtained. The present invention enables direct testing of high-speed serial interface signals by means of the universal ATE during mass produ…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.