Data link layer device and packet encapsulation method thereof
US11336593B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Sep 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L69/22
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A data link layer device and a packet encapsulation method are provided. The data link layer device includes a first and a second first-in-first-out (FIFO) module. The first FIFO module receives and stores multiple first data from an upper-layer module, and removes data gaps from the first data to store the first data in a continuous form. When the first FIFO module is not empty, the first FIFO module generates data of different lengths based on the current amount of data stored temporarily in the first FIFO module and a preset data length. When the data queue of the second FIFO module has enough space to receive the first data, the first FIFO module transfers the first data to the second FIFO module, and the first FIFO module transfers a header including the data length to a header queue of the second FIFO module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.