Methods of manufacturing printed wire boards
US11337309B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2020 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Nov 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa-s to 100,000 Pa-s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa-s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.