Connection of cooling circuit portions for an assembly of two housings
US11337341B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2018 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Aug 1, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2280/08
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention relates to an assembly of two housings, a first housing comprising a first cooling circuit portion and a second housing comprising a second cooling circuit portion, said of this cooling circuit portions being configured to form a cooling circuit with a fluid, each housing comprising a flat face comprising an opening of a respective cooling circuit portion and defining an interface of said cooling circuit, said cooling circuit portions being configured to be fluidically connected by plane-plane contact between said flat faces, said openings being arranged substantially opposite each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.