Element substrate, liquid discharge head, and printing apparatus
US11338581B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2020 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Apr 15, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/13
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
To suppress the progress of metal dissolution by ink when wire break of a wiring to a heater occurs, in an element substrate, according to the present invention, for example, which is used in an inkjet printhead, each of heaters integrated in the element substrate is connected to an individual wiring via a first through-hole penetrating an insulation layer, and further connected to a common wiring from the individual wiring via a wiring formed in another wiring layer via a second through-hole penetrating an insulation layer. The individual wiring and the common wiring are formed in the same wiring layer, and an aspect ratio of the second through-hole is lower than an aspect ratio of the first through-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.