Polymer emulsion as binder for conductive composition
US11339304B2 · kind B2 · utility
0Cited by
13References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2018 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Oct 19, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C1/0466
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided herein are metal conductive compositions with improved conductivity. The improved conductivity is attributable to the addition of a sintering agent and a polymer emulsion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.