Systems and methods for bonding a downhole tool to a surface within the borehole
US11339621B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2020 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Jun 5, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0638
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
An assembly for use in a downhole tool. The assembly may include a body that includes a chamber with a solder suspension contained therein, the solder suspension comprising solder particles, each solder particle comprising an outer shell and a liquid metal core that is exposed and solidifies upon rupture of the outer shell. The assembly may also include a port that allows fluid flow between the chamber and an area outside of the chamber. The assembly may further include a plunger actuatable to apply a force to create a pressure to the solder suspension within the chamber to eject the solder suspension from the port at a velocity to rupture the outer shells of the particles upon contact with a surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.