Automatic recipe optimization for overlay metrology system
US11340060B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2020 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Nov 10, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06N20/10
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An overlay metrology system is disclosed. The overlay metrology system includes a controller configured to be communicatively coupled with an overlay metrology subsystem. The controller receives overlay measurements from the overlay metrology subsystem and generates one or more quality metrics. The controller extracts a set of principle components from the one or more quality metrics. The controller generates input data and inputs the input data into an input matrix of a supervised machine learning algorithm to train a predictive model. The controller then identifies a recipe or hardware configuration with a minimum residual value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.