Patent · US Active

Optical assembly for head-mountable device

US11340466B2 · kind B2 · utility

0Cited by
1References
20Claims
0Family size

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Inventors

Key dates

Filing dateJun 22, 2020
Grant dateMay 24, 2022
Priority date—
Expiry dateFeb 3, 2041

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02C7/12
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Head-mountable devices can include an arrangement of components that include a waveguide that is decoupled from the ability of system loads to be transferred into the waveguide. Such decoupling can be achieved by utilizing an elastic bond with low stiffness to bond certain components together. This allows the system to flex and deform without transferring stress to the waveguide. Such decoupling can also be achieved by selectively bonding in regions that have relatively lower displacements between a support structure and the waveguide. These measures can help preserve component alignment while allowing a head-mountable device to be lightweight and small in size.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.