Apparatus, system, and method for picking, placing, and melting solder sleeves onto shielded electrical wires and cables
US11340575B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2017 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Dec 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/28
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided for wire processing. In certain examples, a wire processing system is disclosed. The wire processing system includes an electrical wire and solder sleeve joining system. The electrical wire and solder sleeve joining system includes an end effector configured to hold a solder sleeve and a split funnel configured to guide insertion of wire into the solder sleeve, allow movement of the solder sleeve through the split funnel in a second position, and prevent movement of the solder sleeve through the split funnel in a first position. The end effector can additionally be configured to remove a slug from the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.